Conductor Structure, Pixel Structure, and Methods of Forming the Same

ABSTRACT

A method for forming a conductor structure is provided. The method comprises: (1) providing a substrate; (2) forming a patterned dielectric layer with a first opening which exposes a portion of the substrate; forming a patterned organic material layer on the dielectric layer with a second opening which corresponds to the first opening and expose the exposed portion of the substrate; (3) forming a first barrier layer on the organic material layer and the exposed portion of the substrate; (4) forming a metal layer on the first barrier layer; and (5) removing the organic material layer, the first barrier layer thereon and the metal layer thereon.

This application claims priority to Taiwan Patent Application No.096119290 filed on May 30, 2007; the technical descriptions of which areincorporated herein by reference in their entirety.

CROSS-REFERENCES TO RELATED APPLICATIONS

Not applicable.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a conductor structure and a method offorming the same. More particularly, the present invention relates to aconductor structure for a display or an electro-optical device and amethod of forming the same.

2. Descriptions of the Related Art

With evolving manufacturing technologies, the liquid crystal display(LCD) has demonstrated its advantage over other displays in terms ofimage compactness, power consumption and service life. As a result, LCDshave been replacing conventional image tube displays. However, with theincrease in the size and resolution of the thin film transistor-LCD(TFT-LCD) panels, the RC delay of signal transmissions within metalconductors has increased. In this case, reducing the RC delay has becomedifficult.

Since the speed of a signal transmission within a conductor isdetermined by the product of the resistance (R) and the capacitance (C)of the conductor, the common solution to reduce the RC delay is using ametal with a low resistivity, such as Al or even Cu. For example, Alconductors have a resistivity of about 5 μΩ/cm, while that of copperconductors may have a resistivity as low as 2.2 μΩ/cm. Hence, if copperconductors are adopted, the resistance value thereof will be decreasedsignificantly, thus eliminating the image delay even for an increasedpanel size. Furthermore, the cost of the material will become lessexpensive than those adopted in the current mass production technology.

A conventional process for manufacturing copper conductors is describedbriefly: a barrier layer 11 and a copper layer 13 is first formed on aglass substrate 10, as shown in FIG. 1A. Then a photoresist layer 15 isformed on the glass substrate 10 and is patterned, as shown in FIG. 1B.Subsequently, an etching process is performed to remove portions of thebarrier layer 11 and the copper layer 13 are not covered by thephotoresist layer, as shown in FIG. 1C. Finally, the photoresist layer15 is removed to complete the copper conductor manufacturing process, asshown in FIG. 1D. However, in the conventional process for manufacturingcopper conductors in an LCD, a number of difficulties have beenencountered. For example, it is difficult to etch copper into apredetermined structure. When a copper conductor is manufactured, it isimpossible to etch the metal with the same etchant solution used inconventional manufacturing processes (e.g. an Al etchant solution). As aresult, new etchant solutions have to be developed, which is very timeconsuming and labor intensive. Furthermore, the etchant solutions usedfor copper have a short life-time, leave residuals in the copper/barrierlayer and render the taper structure is not good. In addition, thecopper element used for forming the conductor structure is prone todiffuse into both the dielectric layer and the semiconductor layer,which may cause a short circuit or electron migration, thus adverselyaffecting the production yield significantly.

It can be seen from the above description that it is difficult topattern the copper layer during the conventional manufacturing process.In view of this, it is important to provide a method for forming acopper conductor structure that can overcome these difficulties.

SUMMARY OF THE INVENTION

The primary objective of this invention is to provide a method forforming a conductor structure, which comprises: providing a substrate;forming a patterned dielectric layer on the substrate, which thedielectric layer has a first opening exposing a portion of thesubstrate; forming a patterned organic material layer on the patterneddielectric layer, which the patterned organic material layer has asecond opening corresponding to a portion of the first opening andexposing the portion of the substrate exposed through the first opening;forming a first barrier layer on a portion of the exposed portion of thesubstrate and on the patterned organic material layer; forming a metallayer on the first barrier layer; and removing the patterned organicmaterial layer, as well as the first barrier layer and the metal layerthereon.

Another objective of this invention is to provide a method for forming aconductor structure, which comprises: providing a substrate; forming adielectric layer on the substrate; forming a patterned organic materiallayer on the dielectric layer, which the patterned organic materiallayer has a first opening with a first width and the first openingexposes a portion of the dielectric layer; removing a portion of thedielectric layer under the first opening to form a second openingcorresponding to the first opening for exposing a portion of thesubstrate, wherein the second opening has one end with a second widththat is proximal to the substrate, and the other end with a third widththat is distal to the substrate; forming a first barrier layer on thesubstrate within the second opening and on the patterned organicmaterial layer; and forming a metal layer on the first barrier layerwithin the second opening and on the patterned organic material layer;wherein the first width is substantially smaller than at least one ofthe second width and the third width, while the second width issubstantially smaller than the third width.

Another objective of this invention is to provide a method for forming aconductor structure, which comprises: providing a substrate; forming apatterned organic material layer on the substrate, wherein the patternedorganic material layer has a first opening that exposes a portion of thesubstrate; forming a first barrier layer on a portion of the exposedportion of the substrate and on the patterned organic material layer;forming a metal layer on the first barrier layer; and removing thepatterned organic material layer, as well as the first barrier layer andthe metal layer on the patterned organic material layer.

Another objective of this invention is to provide a pixel structure,which comprises: a substrate with at least one thin film transistorregion, scanning line region; data line region, and pixel region; acapacitance region; a patterned dielectric layer formed on thesubstrate, which has a plurality of openings is adapted to individuallyexpose a portion of the substrate in the thin film transistor region,the scanning line region, and the capacitance region; a first patternedconductor structure formed above the exposed substrate within theopenings in the thin film transistor region, the scanning line region,and the capacitance region; an insulating layer formed above thesubstrate; an active layer formed on the insulating layer in the thinfilm transistor region; a second patterned conductor structure formed onthe two ends of the active layer and on the insulating layer in the dataline region; and a patterned protective layer formed above thesubstrate.

Another objective of this invention is to provide a pixel structure,which comprises: a substrate with at least one thin film transistorregion, scanning line region, data line region, and pixel region; acapacitance region; an active layer, wherein a portion thereof is formedon the substrate in the thin film transistor region; an insulating layerformed on the substrate; a first patterned dielectric layer formed abovethe substrate with a plurality of first openings being adapted toindividually expose portions of the insulating layer in the thin filmtransistor region, the scanning line region, and the capacitance region;a first patterned conductor structure formed on the exposed insulatinglayer in the thin film transistor region, the scanning line region, andthe capacitance region; a second patterned dielectric layer formed abovethe substrate; a second patterned conductor structure formed on thesecond patterned dielectric layer in the data line region, on the secondpatterned dielectric layer in a portion of the thin film transistorregion, and on the second patterned dielectric layer connected to theactive layer and the capacitance region; a patterned protective layerformed above the substrate; and a patterned pixel electrode formed onthe patterned protective layer in the pixel region connected to thesecond patterned conductor structure in the thin film transistor region.

Another objective of this invention is to provide a pixel structure,which comprises: a substrate with at least one thin film transistorregion, scanning line region, data line region, and pixel region; afirst patterned dielectric layer formed on the substrate and defining aplurality of first openings being adapted to individually exposeportions of the substrate in the thin film transistor region and thedata line region; a first patterned conductor structure formed on theexposed substrate in the thin film transistor region and the data lineregion; an active layer, wherein a portion of the active layer is formedon the substrate in the thin film transistor region and a portion of theactive layer is formed on the substrate in the data line region; asecond patterned dielectric layer formed above the substrate; a secondpatterned conductor structure formed on the second patterned dielectriclayer in the thin film transistor region and on the second patterneddielectric layer in a portion of the data line region; a patternedprotective layer formed above the substrate; and a patterned pixelelectrode formed on the patterned protective layer in the pixel regionand on a portion of the patterned protective layer in the data lineregion, wherein the patterned pixel electrode is connected to the secondpatterned conductor structure in the thin film transistor region.

Another objective of this invention is to provide a method for forming apixel structure which comprises: providing a substrate; forming apatterned dielectric layer on the substrate, which is defined at leastone thin film transistor region, scanning line region, data line region,pixel region, and a capacitance region, wherein the patterned dielectriclayer has a plurality of openings is adapted to individually exposeportions of the substrate in the thin film transistor region, in thescanning line region, and in the capacitance region; forming a firstpatterned conductor structure on the exposed substrate in the thin filmtransistor region, the scanning line region, and the capacitance region;forming an insulating layer above the substrate; forming an active layeron the insulating layer in the thin film transistor region; forming asecond patterned conductor structure on the two ends of the active layerand on the insulating layer in the data line region; and forming apatterned protective layer above the substrate.

Another objective of this invention is to provide a method for forming apixel structure, which comprising: providing a substrate with at leastone thin film transistor region, scanning line region, data line region,pixel region, and capacitance region; forming an active layer, wherein aportion of the active layer is formed on the substrate in the thin filmtransistor region; forming an insulating layer on the substrate; forminga first patterned dielectric layer above the substrate, which defines aplurality of openings is adapted to individually expose the insulatinglayer in portions of the thin film transistor region, the scanning lineregion and the capacitance region; forming a first patterned conductorstructure on the exposed insulating layer in the thin film transistorregion, the scanning line region, and the capacitance region; forming asecond patterned dielectric layer above the substrate; forming a secondpatterned conductor structure on the second patterned dielectric layerin the data line region, on the second patterned dielectric layer in aportion of the thin film transistor region connected to the activelayer, and on the second patterned dielectric layer in the capacitanceregion; forming a patterned protective layer above the substrate; andforming a patterned pixel electrode on the patterned protective layer inthe pixel region, wherein the patterned pixel electrode is connected tothe second patterned conductor structure in the thin film transistorregion.

Another objective of this invention is to provide a method for forming apixel structure, which comprises: providing a substrate with at leastone thin film transistor region, data line region and a pixel region;forming a first patterned dielectric layer on the substrate, whichdefines a plurality of first openings is adapted to individually exposeportions of the thin film transistor region and the data line region;forming a first patterned conductor structure on the exposed substratein the thin film transistor region, and on the exposed substrate in thedata line region; forming an active layer, wherein portions of theactive layer are formed above the substrate in the thin film transistorregion and in the data line region; forming a second patterneddielectric layer above the substrate; forming a second patternedconductor structure on the second patterned dielectric layer in the thinfilm transistor region and in a portion of the data line region; forminga patterned protective layer above the substrate; and forming apatterned pixel electrode on the patterned protective layer in the pixelregion, wherein the patterned pixel electrode is connected to the firstpatterned conductor structure in the thin film transistor region andextended to a portion of the patterned protective layer in the data lineregion.

Another objective of this invention is to provide a display panelcomprising any of the pixel structures described above.

Another objective of this invention is to provide an electro-opticaldevice comprising the display panel described above.

Another objective of this invention is to provide a method of forming adisplay panel, comprising any of the methods of forming a pixelstructure described above.

Yet a further objective of this invention is to provide a method forforming an electro-optical device, comprising the method for forming adisplay panel described above.

The detailed technology and preferred embodiments implemented for thesubject invention are described in the following paragraphs accompanyingthe appended drawings for people skilled in this field to wellappreciate the features of the claimed invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1D are a schematic views of a method of the prior art forforming a conductor structure;

FIGS. 2A to 2E are schematic views of a method for forming a conductorstructure in accordance with this invention;

FIGS. 2F to 2H are schematic views of a method for forming a conductorstructure in accordance with this invention;

FIGS. 3A to 3D are schematic views of another method for forming aconductor structure in accordance with this invention;

FIGS. 4A to 4G are schematic views of a method for forming a pixelstructure in accordance with this invention;

FIG. 4H is a top view of the pixel structure formed in FIG. 4G, whileFIG. 4F is a cross-sectional view taken along line AA′ of FIG. 4H;

FIGS. 5A to 5D are schematic views of another method for forming a pixelstructure in accordance with this invention;

FIG. 5E is a top view of the pixel structure formed in FIG. 5D, whileFIG. 5D is a cross-sectional view taken along line BB′ of FIG. 5E;

FIGS. 6A and 6B are schematic views of yet another method for forming apixel structure in accordance with this invention;

FIG. 6C is a top view of the pixel structure formed in FIG. 6B, whileFIG. 6B is a cross-sectional view taken along line CC′ of FIG. 6C;

FIGS. 7A to 7D are schematic views of still a further method for forminga pixel structure in accordance with this invention;

FIG. 7E is a top view of the pixel structure formed in FIG. 7D, whileFIG. 7D is a cross-sectional view taken along line DD′ of FIG. 7E;

FIGS. 8A to 8F are schematic views of a method for forming another pixelstructure in accordance with this invention;

FIGS. 9A to 9D are schematic views of a method of forming yet anotherpixel structure in accordance with this invention;

FIG. 9E is a top view of the pixel structure formed in FIG. 9D, whileFIG. 9D is a cross-sectional view taken along line EE′ of FIG. 9E; and

FIG. 10 is a schematic view of an electro-optical device utilizing thisinvention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

This invention primarily uses the lift-off process to form the conductorstructure. The first embodiment of this invention is described in briefas follows. As shown in FIG. 2A, a patterned dielectric layer 103 isformed on the substrate 101. The substrate 101 is generally, made ofglass, especially free of alkali metal ions (e.g. Na⁺, K⁺) with a lowthermal expansion coefficient. However, the substrate can also be madeof other materials. Alternatively, the substrate may be optionally madeof a transparent material, an opaque material or a flexible material.The transparent material may include, but is not limited to, quartzes,other kinds of glass (such as window glass or other glass), or othertransparent materials. The opaque material may include, but is notlimited to, ceramics, wafers, or other opaque materials, while theflexible material may include, but is not limited to, polyamides,polyesters, polyolefins, polyalcohols, polymethyl methacrylates (PMMA),polycarbonates (PC), other thermosetting polymers, other thermoplasticpolymers, or a combination thereof.

The patterned dielectric layer 103 may be optionally made of aninorganic material, an organic material, or a combination thereof. Theinorganic material may include, but is not limited to silicon nitride,silicon oxide, silicon oxynitride, silicon carbide, silicon oxyfluoride,fluorinated silicate glass (FSG), carbon-doped FSG, other inorganicmaterials, or a combination thereof. The organic material may include,but is not limited to, benzocyclobutene (BCB), parylene-N (PA),fluorinated polyimide (FP), SiOC—H, poly aryl-ethers, hydrogensilsesqioxane (HSQ), methylsilsesquioxane (MSQ), other organicmaterials, or a combination thereof.

The patterned dielectric layer 103 has a first opening 105 which exposesa portion of the substrate 101. The first opening 105 has a first widthW1 at one end proximate to the substrate 101, and a second width W2 atthe end distal from the substrate 101. The second width W2 issubstantially different from the first width W1, and preferably, forconvenience of the subsequent procedures, is substantially greater thanthe first width W1. The difference between the second width W2 and thefirst width W1 should be substantially greater than or equal to 1 μm,but is not just limited thereto. To obtain such a preferable structure,for example, the patterned dielectric layer 103 is typically depositedin such a way that the portions of the patterned dielectric layer 103closer to the substrate 101 have a substantially slower deposition ratethan those further from the substrate 101. The deposition manner allowsthe upper and lower portions of the patterned dielectric layer 103 to beetched at different rates and typically used to a wet etching process.Alternatively, the patterned dielectric layer 103 is typically depositedin such a way that portions of the patterned dielectric layer 103 closerto the substrate 101 have a deposition rate and those further from thesubstrate 101 have a deposition rate are substantially identical andtypically used to the wet etching of the over-etching procedure.However, the upper portion and the lower portion may be made of the sameor different materials. Alternatively, depending on requirements of themanufacturing process, other approaches such as a dry etching process orboth of the dry etching process and the wet etching process may be usedinstead to make the second width W2 substantially greater than the firstwidth W1.

Next, as shown in FIG. 2B, a patterned organic material layer 107 isformed on the patterned dielectric layer 103. The patterned organicmaterial layer 107 is typically made of a material comprisingphotoresist materials, light sensitive materials, benzocyclobutene(BCB), parylene-N (PA), fluorinated polyimide (FP), SiOC-H, polyaryl-ethers, hydrogen silsesqioxane (HSQ), methylsilsesquioxane (MSQ),other materials, or a combination thereof. In this embodiment, thematerial is a positive photoresist, although it is not just limitedthereto. Alternatively, other photoresist materials may be optionallyused, such as a negative photoresist, or other photoresist materials.The positive photoresist used in this embodiment is a light sensitivematerial typically made of a mixture of a light sensitizer, a resin anda solvent, which will undergo a chain scission under irradiation of aparticular light beam and therefore is solvable in a developer solution.

The patterned organic material layer 107 has a second opening 109defined therein, which corresponds to a portion of the first opening 105and also exposes a portion of the exposed portion of the substrate 101.At the proximal end of the interface between the organic material layer107 and the dielectric layer 103, the second opening 109 has a thirdwidth W3, which should be substantially smaller than or equal to eitherthe first width W1 or the second width W2. In this embodiment, the thirdwidth W3 will be used to define the width of the conductor structure,but is not just limited thereto.

Subsequently, a barrier material, may or may not be used depending onthe requirements of the specific design. For example, if copper is usedin the following procedures, a barrier layer will have to be formedthereunder. The barrier material may optionally comprise a metalmaterial, such as Mo, Ti, Ta, W, Cr, Al, Cu, other metals, nitridesthereof, oxides thereof, oxynitrides thereof, alloys thereof, Al alloysthereof, Cu alloys thereof, or a combination of the previous metals.Alternatively, the barrier material may optionally comprise atransparent conductive material, such as indium tin oxide (ITO), indiumzinc oxide (IZO), aluminum zinc oxide (AZO), and gallium zinc oxide(GZO), cadmium tin oxide (CTO), other materials, or a combinationthereof. Still alternatively, other appropriate materials may beoptionally selected as a barrier material. For purpose of description,an aspect incorporating the barrier layer will be described in thisembodiment.

In FIG. 2C, a first barrier layer 111 is formed on the portion of thesubstrate 101 exposed by the first opening 105 and the second opening109 and on the patterned organic material layer 107. In FIG. 2D, a metallayer 113 is then formed on the barrier layer 111 in the first opening105 and the second opening 109 and on the barrier layer 111 above thepatterned organic material layer 107. The metal layer 113 may be made ofAl, Cu, Ag, Au, Mo, Nd, Al, other materials, alloys thereof, or acombination of the foregoing. Preferably, to prevent the influencerelated to subsequent manufacturing processes on the metal layer 113, asecond barrier layer (not shown) is further formed on the metal layer113 both in the first opening 105 and above the patterned organicmaterial layer 107.

Finally, an appropriate solvent (e.g., a developer solution or othersolvents) is used to dissolve and remove the patterned organic materiallayer 107 via the first opening 105. Since the third width W3 is smallerthan the second width W2, the patterned organic material layer 107 isremoved at the same time that the solvent flows into the first opening105 to lift off the patterned organic material layer 107, as well as thefirst barrier layer 111 and the metal layer 113 formed thereon, as shownin FIG. 2E. The preceding steps result in a metal layer 113 formed onthe substrate 101 for use as a conductor structure in the followingprocesses.

In addition, another method of forming the structure shown in FIG. 2Bwill be described briefly. Referring to FIG. 2F, a dielectric layer 123is formed on a substrate 121. Afterwards, as shown in FIG. 2G, apatterned organic material layer 127 with a first opening 129 is formedon the dielectric layer 123. The first opening 129 exposes a portion ofthe dielectric layer 123 and has a first width W4. Then a portion of thedielectric layer 123 under the first opening 129 is removed to form asecond opening 125 corresponding to the first opening 129, thusobtaining a structure as shown in FIG. 2H. The second opening 125exposes a portion of the substrate 121, and has a second width W5 at oneend proximate to the substrate 121 and a third width W6 at the other enddistal from the substrate 121. The second width W5 is substantiallydifferent from the third width W6. The first width W4 is substantiallysmaller than or equal to at least one of the second width W5 and thethird width W6. Preferably, in removing a portion of the dielectriclayer 123 under the first opening 129, an over-etching procedure isperformed to make the side walls of the second opening 125 within thedielectric layer 123 taper inwards under the patterned organic materiallayer 127; that is, the third width W6 is substantially greater than thefirst width W4. Specifically, the difference between the second width W5and the third width W6, preferred should be substantially greater thanor equal to 1 μm, but is not just limited thereto. To obtain such apreferable structure, for example, the patterned dielectric layer 123 istypically deposited in such a way that portions of the patterneddielectric layer 123 closer to the substrate 121 have a substantiallyslower deposition rate than those further from the substrate 121, sothat the upper portion and the lower portion of the patterned dielectriclayer 123 will be etched at different rates and typically used to a wetetching process. Alternatively, the patterned dielectric layer 123 istypically deposited in such a way that portions of the patterneddielectric layer 123 closer to the substrate 121 have a deposition rateand those further from the substrate 121 have a deposition rate aresubstantially identical and typically used to the wet etching of theover-etching procedure. However, the upper portion and the lower portionmay be made of the same or different materials. Alternatively, dependingon the requirements of the manufacturing process, other approaches suchas a dry etching process or both of the dry etching process and the wetetching process may be used instead to make the third width W6substantially greater than the second width W5. By comparing FIG. 2H andFIG. 2B, it can be seen that the structure depicted in FIG. 2H issubstantially equivalent to that depicted in FIG. 2B, so the subsequentsteps following FIG. 2H are just the same as those described in FIGS. 2Cto 2E and will not be described again. In addition, as compared to themethod shown in FIGS. 2A to 2E which uses two lithographic processingsteps, this method utilizes only a single lithographic processing step,which may reduce the manufacturing cost.

The second embodiment of the method for forming a conductor structurewill be described briefly. In reference to FIG. 3A, a patterned organicmaterial layer 307 with a first opening 305 defined thereon is formed onthe substrate 301. The first opening 305 exposes a portion of thesubstrate 301, and has a first width W7 at one end proximate to thesubstrate 301 and a second width W8 at the distal end from the substrate301. The organic material layer 307 may be made of a material comprisingphotoresist materials, light sensitive materials, benzocyclobutene(BCB), parylene-N (PA), fluorinated polyimide (FP), SiOC-H, polyaryl-ethers, hydrogen silsesqioxane (HSQ), methylsilsesquioxane (MSQ),other materials, or a combination thereof.

In the second embodiment, the patterned organic material layer 307 ismade of a negative photoresist, although it is not just limited thereto.Alternatively, other photoresist materials may be optionally used, suchas a positive photoresist, or other photoresist materials. The negativephotoresist used in this embodiment tends to have its molecular bondscross-linked under irradiation of a particular light beam, and thereforeis insolvable in a solvent. Generally, for convenience of the followingprocedures, the second width W8 should be substantially smaller than thefirst width W7. In other words, the edge of the patterned organicmaterial layer 307 should be shaped into a inverted taper form such asthe edge of the patterned organic material layer 307 at the distal endfrom the substrate 301 has a width is substantially greater than theedge of the patterned organic material layer 307 at one end proximate tothe substrate 301 has a width, namely the edge of the patterned organicmaterial layer 307 is upper wider and lower narrow form or is upwardlybroadening form, as shown in FIG. 3A. The difference between the secondwidth W8 and the first width W7 should also be substantially greaterthan or equal to 1 μm, but is not just limited thereto. In addition toforming the organic material layer 307 with the negative photoresist inthis embodiment, deposition of the patterned organic dielectric layer307 may also be controlled, so that the upper portion and the lowerportion thereof will be etched at different rates. Of course, dependingon the requirements of the manufacturing process, other approaches mayalso be used instead to make the second width W8 substantially smallerthan the first width W7.

Subsequently, a barrier layer with a barrier material may or may not beused depending on the requirements of the specific design. For example,if copper is used in the following procedures, a barrier layer will haveto be formed thereunder. The barrier material may comprise a metalmaterial, such as Mo, Ti, Ta, W, Cr, Al, Cu, other metals, nitridesthereof, oxides thereof, oxynitrides thereof, alloys thereof, Al alloysthereof, Cu alloys thereof, or a combination of the previous metals.Alternatively, the barrier material may comprise a transparentconductive material, such as indium tin oxide (ITO), indium zinc oxide(IZO), aluminum zinc oxide (AZO), and gallium zinc oxide (GZO), cadmiumtin oxide (CTO), other materials, or a combination thereof. Stillalternatively, other appropriate materials may be optionally selected asa barrier material. For purpose of description, an aspect incorporatinga barrier layer will be described in this embodiment.

As shown in FIG. 3B, a first barrier layer 311 is formed on the exposedportion of the substrate 301 and the patterned organic material layer307. Next, as shown in FIG. 3C, a metal layer 313 is then formed on thebarrier layer 311 both within the first opening 305 and above thepatterned organic material layer 307. The metal layer 113 may be made ofany of the materials described in the first embodiment depending on thespecific requirements. To prevent influence related to the subsequentmanufacturing processes on the metal layer 313, a second barrier layer(not shown) is further formed on the metal layer 313 both within thefirst opening 305 and above the patterned organic material layer 307.

Finally, referring to FIG. 3D, an appropriate solvent (e.g., a developersolution or other solvents) is used to dissolve and remove the patternedorganic material layer 307 via the first opening 305. At the same timewhen the patterned organic material layer 307 is being removed, thefirst barrier layer 311 and the metal layer 313 on the patterned organicmaterial layer 307 will also be lifted off. The preceding steps resultin a metal layer 313 formed on the substrate 301 for use as a conductorstructure in the following steps.

The above embodiments of this invention may also be applied to form apixel structure. For example, the third embodiment is also an embodimentfor forming a pixel structure in accordance with this invention, andwill be described briefly as follows. FIG. 4G is a cross-sectional viewtaken along line AA′ in FIG. 4H. In reference to FIG. 4A, a substrate401 is defined a thin film transistor (TFT) region 4011, a scanning lineregion 4013, a data line region 4015, a pixel region 4017, and acapacitance region 4019. For purpose of description, the scanning lineregion 4013 denoted in FIGS. 4A to 4H is only illustrative of a portionof the scanning line region, while the data line region 4015 is onlyillustrative of a portion of the data line region. Both the data lineregion 4015 and the scanning line region 4013 have a contact pad region(not shown) at respective ends, so that other elements (e.g. an externalelement not shown) may be electrically connected to the data line region4015 and the scanning line region 4013 via the contact pad regions.Then, a patterned dielectric layer 403 is formed on the substrate 401.The patterned dielectric layer 403 has a plurality of openings 4051,4053 and 4059 are adapted to respectively expose a portion of thesubstrate 401 in the TFT region 4011, the scanning line region 4013, andthe capacitance region 4019. The patterned dielectric layer 403 may bemade of one of the materials described in the first embodiment dependingon the specific requirements.

Next, in reference to FIG. 4B, a first patterned conductor structure4131 is formed above the exposed substrate 401 within the openings inthe TFT region 4011, the scanning line region 4013, and the capacitanceregion 4019. The first patterned conductor structure 4131 may be formedusing the methods described in the above embodiments. For example, themethod described in the first embodiment is described as follows: apatterned organic material layer (not shown) with a plurality of secondopenings (not shown) is first formed on the patterned dielectric layer403, wherein the plurality of second openings correspond to the openings4051, 4053 and 4059 and expose a portion of the exposed portion of thesubstrate 401, respectively. Thereafter, a conductor structure (notshown) is formed on the exposed portion of the substrate 401 and thepatterned organic material layer. Finally, the patterned organicmaterial layer and the conductor structure thereon are removed,remaining only the conductor structure within the openings 4051, 4053and 4059 to form the first patterned conductor structure 4131. It shouldbe noted that the preferred embodiment of the method of forming openingsto expose a portion of the substrate and forming the conductor structureis either another method of forming the structure shown in FIG. 2B inthe first embodiment, or the method of forming the structure of thesecond embodiment, which means there is no patterned dielectric layer403, but only the conductor structure, formed on the substrate.

For example, the first patterned conductor structure 4131 comprises ametal layer, the material of which may be determined depending on thespecific requirements. Depending on the metal material used in the firstpatterned conductor structure 4131 or requirements of the design or ofthe subsequent use, a barrier layer may be formed. For example, ifcopper is used for the metal layer of the first patterned conductorstructure 4131, a barrier layer (e.g. a Mo layer) may have to be formedunder the metal layer. The barrier material may be made of one of thematerials described in the first embodiment depending on the specificrequirements. Furthermore, a second barrier layer may be formed in thefirst patterned conductor structure 4131 if desired. For purpose ofdescription, a structure without a barrier is depicted in FIG. 4B.

Next, as shown in FIG. 4C, an insulating layer 415 is formed on thesubstrate 401. Then in FIG. 4D, an active layer 417 is formed on theinsulating layer 415 in the TFT region 4011, which comprises a non-dopedlayer 4171 and a doped layer 4173. Depending on the specificrequirements, a portion of the active layer (not shown) may be formed onthe insulating layer 415 in the capacitance region 4019 as a portion ofthe capacitance structure, and/or formed in the overlapping area betweenthe data line region and the scanning line region. Additionally, anetching stop layer (not shown) may be formed on the active layer 417 inthe TFT region 4011, and/or on the overlapping area between the dataline region and the scanning line region. If formed on the active layer417 in the TFT region 4011, the etching stop layer (not shown),preferred should be formed on the non-doped layer 4171 with the dopedlayer 473 partially overlapping the etching stop layer. Though thenon-doped layer 4171 and the doped layer 4173 are arranged vertically inthis embodiment, they are not limited to this arrangement, and may alsobe arranged horizontally. Furthermore, the non-doped layer 4171 may alsobe optionally replaced by another doped layer (not shown) with asubstantially lower dopant concentration than the doped layer 4173.Furthermore, an additional doped layer (not shown) with a substantiallylower dopant concentration than the doped layer 4173 may be optionallyprovided between the doped layer 4173 and the non-doped layer 4171.

Next, in FIG. 4E, a second patterned conductor structure 419 comprisingsource/drain electrodes 4191 and a data line 4193 is formed on both endsof the active layer 417 and on the insulating layer 415 in the data lineregion 4015. Both ends of the doped layer 4173 are electricallyconnected to the second patterned conductor structure 419 respectively,and particularly, the source/drain electrodes 4191 are electricallyconnected to both ends of the doped layer 4173 respectively. Of course,depending on the specific requirements, the second patterned conductorstructure 419 (not shown) may also be formed on the insulating layer 415in the capacitance region 4019 as a portion of the capacitancestructure. The second patterned conductor structure 419 comprises ametal layer, the material of which may be determined depending on thespecific requirements, as described with respect to the metal layer 113in the first embodiment.

Additionally, depending on the metal material used in the secondpatterned conductor structure 419 or requirements of the design or ofthe subsequent use, a barrier layer may be formed of a barrier material.For example, if copper is used for the metal layer of the secondpatterned conductor structure 419, a barrier layer (e.g. a Mo layer) mayhave to be formed under the metal layer. Furthermore, a second barrierlayer may be formed in the second patterned conductor structure 419 ifdesired. The barrier material may be made from one of the materialsdescribed in the first embodiment depending on the specificrequirements. Additionally, the active layer 417 and the secondpatterned conductor structure 419 may be formed on the insulating layerin the capacitance region. For description purposes, a structure withouta barrier is depicted in FIG. 4E. Alternatively, the method described inthe second embodiment, that described in the first embodiment may beoptionally used to form the second patterned conductor structure 419, orgeneral methods, which will not be described herein again.

Next, as shown in FIG. 4F, a patterned protective layer 421 is formedabove the substrate 401. Finally, referring to FIG. 4G, a patternedpixel electrode 423 is formed on the patterned protective layer 421 inthe pixel region 4017, and is electrically connected to the secondpatterned conductor structure 419 at either end of the active layer 417.The method of forming a patterned pixel electrode 423 may be determineddepending on requirements of the manufacturing process. For example, themethod may be (1) common (i.e., a pixel electrode 423 is first formed onthe patterned protective layer 421, after which a patterned organicmaterial layer (not shown) is formed thereon, and then portions of thepixel electrode 423 not covered by the patterned organic material layerare removed), (2) the method for forming the structure in the firstembodiment, (3) the method for forming the structure in the secondembodiment, or (4) other suitable methods. Here, a brief description ismade using the method for forming the structure in the second embodimentas an example. A patterned organic material layer (not shown) is firstformed on the substrate 401, which has a third opening (not shown)exposing a portion of the patterned protective layer 421. Then, a pixelelectrode 423 is formed on the portion of the patterned protective layerexposed through the third opening and on the patterned organic materiallayer. Finally, the patterned organic material layer and a portion ofthe pixel electrode thereon are removed. As will be appreciated by thoseof ordinary skill in the art, this embodiment has the following featuresdepending on the requirements of a specific application or design. If abarrier layer is formed of a transparent conductive material under thefirst patterned conductor structure 4131 in the step shown in FIG. 4B,the barrier layer may be used as a pixel electrode, i.e., no other pixelelectrodes need to be formed on the patterned protective layer 421.Alternately, the first patterned conductor structure 4131 may be has thebarrier layer is formed of a transparent conductive material is as thepixel electrode and without the preformed the barrier layer is shown inFIG. 4B. In other words, the first patterned conductor structure 4131generally includes the barrier layer and the metal layer but not existthe preformed the barrier layer, the first patterned conductor structure4131 can be includes the metal without the barrier layer but exist thepreformed the barrier layer, or the first patterned conductor structure4131 can be includes the barrier layer and the metal layer and beingexist the preformed the barrier layer. In respect of this, as shown inFIG. 5A, a substrate 501 is defined at least a TFT region 5011, dataline region (not shown), scanning line region (not shown), pixel region5017, and capacitance region 5019. For description purposes, the pixelregion 5017 denoted in FIGS. 5A to 5E is only illustrative of a portionof the pixel region, i.e., the pixel region in this embodiment compriseslocations of the transparent conductive layer 511 and the capacitanceregion 5019. Additionally, both the data line region and the scanningline region have a contact pad region (shown as the data line contactpad region 5014 and the scanning line contact pad region 5012) atrespective ends, so that other elements (e.g. an external element notshown) may be electrically connected to the data line region and thescanning line region via the contact pad regions. A patterned dielectriclayer 503 is formed on the substrate 501. In each of the regions, atransparent conductive layer 511 is formed under the first patternedconductor structure 5131. Then, as shown in FIG. 5B, an insulating layer515 is formed on the substrate. In reference to FIG. 5C, an active layer517 comprising a non-doped layer 5171 and a doped layer 5173 is formedon the insulating layer 515. A portion of the active layer 517 and aportion of the insulating layer 515 are removed by a lithographic andetching process to form a structure shown in FIG. 5C. Next, in referenceto FIG. 5D, a second patterned conductor structure 519 is formed, afterwhich a portion of the first patterned conductor structure 5131 and aportion of the second patterned conductor structure 519 are removed byan etching process. The etching process exposes the transparentconductive layer 511 in the pixel region 5017, the data line contact padregion 5014 and the scanning line contact pad region 5012. Finally, apatterned protective layer 521 is formed on the substrate 501 tocomplete the structure as shown in FIG. 5D.

Still further, as will be appreciated by those of ordinary skill in theart, depending on the requirements of a specific application or design,this embodiment may employ in the steps subsequent to FIG. 5B ahalf-tone mask, a slit pattern mask, a diffraction mask, a gray levelmask, or other masks that may let an organic material layer (e.g., aphotoresist) with different thicknesses after exposure. In reference toFIGS. 6A to 6C, a brief description will be made on such a variationhereinafter, in which FIG. 6B is a cross-sectional view taken along lineCC′ in FIG. 6C. A substrate 601 is defined at least a TFT region 6011,data line region (not shown), scanning line region (not shown), pixelregion 6017, and capacitance region 6019. For description purposes, thepixel region 6017 denoted in FIGS. 6A to 6E is only illustrative of aportion of the pixel region, i.e., the pixel region in this embodimentcomprises locations of the transparent conductive layer 611 and thecapacitance region 6019. Additionally, both the data line region and thescanning line region have a contact pad region (shown as the data linecontact pad region 6014 and the scanning line contact pad region 6012)at respective ends, so that other elements (e.g. an external element notshown) may be electrically connected to the data line region and thescanning line region via the contact pad regions. As shown in FIG. 6A,upon completion of the step shown in FIG. 5B, an active layer 617comprising a non-doped layer 6171 and a doped layer 6173 is formed onthe insulating layer 615, while a portion of the active layer 617 and aportion of the insulating layer 615 are removed by a lithographic andetching process using a half-tone mask. A patterned dielectric layer603, first patterned conductor structure 6131, transparent conductivelayer 611 and insulating layer 615 are formed on the substrate 601covering each of the preceding layers. Next, in reference to FIG. 6B,upon completion of the lithographic and etching process, a secondpatterned conductor structure 619 is formed on the substrate 601, afterwhich a portion of the first patterned conductor structure 6131 and aportion of the second patterned conductor structure 619 are removed byan etching process. The etching process involves exposing a portion ofthe transparent conductive layer 611. Finally, a patterned protectivelayer 621 is formed on the substrate 601. Moreover, the organic materiallayer (not shown) used to remove a portion of the first patternedconductor structure 6131 and a portion of the second patterned conductorstructure 619 may be optionally not removed, but reflowed by a reflowingprocedure to act as the patterned protective layer 621, thus eliminatingthe step of forming the patterned protective layer.

The first patterned conductor structure in this embodiment may also beformed using the aforesaid method of forming the structure of the secondembodiment, which will be described briefly. FIG. 7A illustrates asubstrate 701 is defined at least a TFT region 7011, a data line region(not shown), a scanning line region (not shown), a pixel region 7017,and a capacitance region 7019. For description purposes, the pixelregion 7017 denoted in FIGS. 7A to 7E is only illustrative of a portionof the pixel region, i.e., the pixel region in this embodiment compriseslocations of the transparent conductive layer 711 and the capacitanceregion 7019. Additionally, both the data line region and the scanningline region have a contact pad region (shown as the data line contactpad region 7014 and the scanning line contact pad region 7012) atrespective ends, so that other elements (e.g. an external element notshown) may be electrically connected to the data line region and thescanning line region via the contact pad regions. A patterned organicmaterial layer 707 comprising a plurality of openings 7051, 7052, 7054,7057 and 7059 is formed on the substrate 701, which, for example, may beformed of a negative photoresist. Thereafter, a transparent conductivelayer 711 and a first patterned conductor structure 7131 are formedsequentially on the substrate 701 in the openings 7051, 7052, 7054, 7057and 7059, as well as on the organic material layer 707. Afterwards, anappropriate solvent is used to remove the organic material layer 707, aswell as the transparent conductive layer 711 and the first patternedconductor layer 7131 thereon, thus obtaining a structure as shown inFIG. 7B. Next, in reference to FIG. 7C, a patterned insulating layer 715and a patterned active layer 717 comprising a non-doped layer 7171 and adoped layer 7173 are formed sequentially on the substrate 701.Subsequently, as shown in FIG. 7D, a second patterned conductorstructure 719 is formed, after which a portion of the first patternedconductor structure 7131 and a portion of the second patterned conductorstructure 719 above the substrate 701 are removed by an etching process.The etching process involves exposing a portion of the transparentconductive layer 711. Finally, a patterned protective layer 721 isformed on the substrate 701 to complete a structure as shown in FIG. 7D.Moreover, the organic material layer (not shown) used to remove aportion of the first patterned conductor structure 7131 and a portion ofthe second patterned conductor structure 719 may be kept and reflowedusing a reflowing procedure to act as the patterned protective layer721, thus, eliminating the step of forming the patterned protectivelayer.

The conductor structure of this invention may further be applied to forma fourth embodiment of the pixel structure, which is described briefly.FIG. 8A illustrates, a substrate 801 defined at least a TFT region 8011,a scanning line region 8013, a data line region 8015, a pixel region8017, and a capacitance region 8019. For description purposes, the pixelregion 8017 denoted in FIGS. 8A to 8F is only illustrative of a portionof the pixel region. Then, an active layer 817 is formed, with a portionthereof formed on the substrate 801 in the TFT region 8011. Depending onthe specific requirements, the substrate 801 in the capacitance region8019 may also have a portion of the active layer (not shown) formedthereon. The active layer 817 typically comprises a highly doped region,a lightly doped region, a non-doped region, or a combination thereof.Subsequently, an insulating layer 815 is formed on the substrate 801,followed by the formation of the first patterned dielectric layer 825 onthe substrate 801. The first patterned dielectric layer 825 has aplurality of first openings 8051, 8053 and 8059 defined thereon forexposing portions of the insulating layer 815 in a portion of the TFTregion 8011, a portion of the scanning line region 8013, and a portionof the capacitance region 8019 respectively, as shown in FIG. 8B.Additionally, depending on the specific requirements of themanufacturing process, the deposition rate of the first patterneddielectric layer 825 may be controlled in such a way that portions ofthe first patterned dielectric layer 825 formed earlier have asubstantially slower deposition rate than those formed later. As aresult, the upper portion and the lower portion of the first patterneddielectric layer 825 will be etched at different rates and typicallyused to a wet etching process. In this embodiment, the upper portion andthe lower portion of the first patterned dielectric layer 825 may bemade of substantially the same or different materials. Alternatively,depending on the requirements of the manufacturing process, otherapproaches such as a dry etching process or both of the dry etchingprocess and the wet etching process may be used instead to accomplishthis goal. The active layer 817 typically comprises a highly dopedregion, a lightly doped region, a non-doped region, or a combinationthereof, which may be optionally formed simultaneously or separately. Itshould be noted that the method for forming the openings to expose aportion of the substrate is preferably the method for forming thestructure shown in FIGS. 2F to 2H.

Next, in reference to FIG. 8C, a first patterned conductor structure8131 is formed on the insulating layer 815 in the TFT region 8011, thescanning line region 8013 and the capacitance region 8019. The firstpatterned conductor structure 8131 comprises a metal layer, the materialof which may be determined depending on the specific requirements. Forexample, the material may be the same as that used to form the metallayer 113 in the first embodiment. Depending on the metal material usedin the first patterned conductor structure 8131 or requirements of thedesign, a barrier layer may be formed. For example, if copper is usedfor the metal layer of the first patterned conductor structure 8131, abarrier layer (e.g. a Mo layer) may have to be formed under the metallayer. The barrier material may be selected as described in the firstembodiment depending on the specific requirements. For descriptionpurposes, this embodiment will be described with reference to an aspectwithout a barrier.

A method for forming the first patterned conductor structure 8131 may besimilar to that used to form the structure of the first embodiment,which will be described in briefly. A patterned organic material layer(not shown) with a plurality of second openings (not shown) is firstformed on the first patterned dielectric layer 825. The plurality ofsecond openings correspond to some of the first openings 805 and exposea portion of the exposed portion of the substrate 801 respectively.Thereafter, a first conductor structure (not shown) is formed on theexposed portion of the substrate 801 and the patterned organic materiallayer. Finally, the patterned organic material layer and the firstconductor structure thereon are removed to complete the structure asshown in FIG. 8C.

Another method for forming the first patterned conductor structure 8131may be similar to that used to form the structure of the secondembodiment, which will not be described again herein. Of course,depending on the requirements of the manufacturing process, othermethods may also be used to form the first patterned conductor structure8131. For description purposes, this embodiment is described withrespect to the same method described just in the previous paragraph.Additionally, depending on the requirements of the manufacturingprocess, the deposition rate of the first patterned dielectric layer 825may be controlled in such a way that portions of the first patterneddielectric layer 825 formed earlier have a substantially slowerdeposition rate than those formed later.

In reference to FIG. 8D, a second patterned dielectric layer 827 isformed on the substrate. Then, as shown in FIG. 8E, a second patternedconductor structure 819 is formed on the second patterned dielectriclayer 827 in the data line region 8015, the capacitance region 8019 anda portion of the TFT region 8011. The second patterned conductorstructure 819 in the portion of the TFT region 8011 is electricallyconnected to the active layer 817. Preferably, the second patternedconductor structure 819 in the capacitance region 8019 is electricallyconnected to the second patterned conductor structure 819 in the portionof the TFT region 8011 (such an electrical connection is not shownhere), but is not limited thereto.

The second patterned conductor structure 819 comprises a metal layer,the material of which may be determined depending on the specificrequirements. For example, the material may be the same as that used toform the metal layer in the first embodiment. Depending on the metalmaterial used in the second patterned conductor structure 819 orrequirements of the design, a barrier layer may be formed. For example,if copper is used for the metal layer of the second patterned conductorstructure 819, a barrier layer (e.g. a Mo layer) may have to be formedunder the metal layer. The barrier material may be selected as describedin the first embodiment depending on the specific requirements.Thereafter, a patterned protective layer 821 is formed on the substrate801.

Finally, in reference to FIG. 8F, a patterned pixel electrode 823 isformed on the patterned protective layer 821 in the pixel region 8017,and is electrically connected to the second patterned conductorstructure 819 in the TFT region 8011. The method for forming a patternedpixel electrode 823 may be determined depending on requirements of themanufacturing process. For example, the method may be (1) common (i.e.,a pixel electrode 823 is first formed on the patterned protective layer821, after which a patterned organic material layer (not shown) isformed thereon, and then portions of the pixel electrode 823 not coveredby the patterned organic material layer are removed), (2) the method forforming the structure of the first embodiment, (3) the method forforming the structure of the second embodiment, or (4) other suitablemethods. Here, a brief description is made with the method for formingthe structure of the second embodiment as an example: a patternedorganic material layer (not shown) is first formed on the substrate 801,which has a third opening (not shown) exposing a portion of thepatterned protective layer 821. Then, a pixel electrode 823 is formed onthe portion of the patterned protective layer exposed through the thirdopening and on the patterned organic material layer. Finally, thepatterned organic material layer and a portion of the pixel electrodethereon are removed to complete the structure shown in FIG. 8F.

The conductor structure of this invention may further be applied to forma fifth embodiment of the pixel structure, which will be describedbriefly. FIG. 9E illustrates a top view of a pixel structure formed inFIG. 9D, and FIG. 9D is a cross-sectional view taken along line EE′.FIG. 9A illustrates a substrate 901 defined at least a TFT region 9011,a data line region 9015, and a pixel region 9017. For descriptionpurposes, the pixel region 9017 denoted in FIGS. 9A to 9E is onlyillustrative of a portion of the pixel region, and the data line region9015 denoted in these figures is only illustrative of a portion of thedata line region. Then, the first patterned dielectric layer 925 isformed on the substrate 901. The first patterned dielectric layer 925has a plurality of first openings defined therein, and FIG. 9Aillustrates the first openings 9051 and 9055 for exposing the TFT region9011 and the data line region 9015 respectively. Additionally, dependingon the requirements of the manufacturing process, the deposition rate ofthe first patterned dielectric layer 925 may be controlled in such a waythat portions of the first patterned dielectric layer 925 formed earlierhave a substantially slower deposition rate than those formed later. Asa result, the upper portion and the lower portion of the first patterneddielectric layer 925 will be etched at different rates and typicallyused to a wet etching process. The upper portion and the lower portionof the first patterned dielectric layer 925 may be made of the same ordifferent materials. Alternatively, depending on the requirements of themanufacturing process, other approaches such as a dry etching process orboth of the dry etching process and the wet etching process may be usedinstead to accomplish this goal. It should be noted that the method forforming openings to expose a portion of the substrate is preferably themethod used for forming the structure shown in FIGS. 2F to 2H.

Next, as shown in FIG. 9B, a first patterned conductor structure 9131 isformed on the exposed portions of the substrate 901 through the firstopenings 9051, 9055 in the TFT region 9011 and the data line region9015. The first patterned conductor structure 9131 comprises a metallayer, the material of which may be determined depending on therequirements in practical use. For example, the material may be thatused to form the metal layer in the first embodiment. Depending on thematerial of the metal used in the first patterned conductor structure9131 or requirements of the design, a barrier layer may be formed. Forexample, if copper is used for the metal layer of the first patternedconductor structure 9131, a barrier layer (e.g. a Mo layer) may have tobe formed under the metal layer. The barrier material may be selected asdescribed in the first embodiment depending on the specificrequirements. For description purposes, this embodiment will bedescribed with reference to an aspect without a barrier.

A method for forming a first patterned conductor structure 9131 may besimilar to that used to form the structure of the first embodiment,which will be described briefly. A patterned organic material layer (notshown) with a plurality of second openings (not shown) is first formedon the first patterned dielectric layer 925. The plurality of secondopenings corresponds to the first opening 9051, 9055 and expose aportion of the exposed portion of the substrate 901 respectively.Thereafter, a first conductor structure (not shown) is formed on theexposed portion of the substrate 901 and the patterned organic materiallayer. Finally, the patterned organic material layer and the firstconductor structure thereon are removed. Another method for forming thefirst patterned conductor structure 9131 may be similar to that used toform the structure of the second embodiment, which will not be describedagain herein. Of course, depending on requirements of the manufacturingprocess, other methods may also be used to form the first patternedconductor structure 9131. For description purposes, this embodiment isdescribed with respect to an aspect utilizing the method of forming thestructure of the first embodiment.

Yet another method for forming the first patterned conductor structure9131 may be similar to that used to form the structure of the secondembodiment, which will not be described again herein. Of course,depending on the requirements of the manufacturing process, othermethods may also be used to form the first patterned conductor structure9131. For description purposes, this embodiment is described withrespect to an aspect using the method described just in the previousparagraph. Additionally, depending on the requirements of themanufacturing process, the deposition rate of the first patterneddielectric layer 925 may be controlled in such a way that portions ofthe first patterned dielectric layer 925 formed earlier have asubstantially slower deposition rate than those formed later.

Next, as shown in FIG. 9B, an active layer 917 is formed, a portion ofwhich is located on the substrate 901 in the TFT region 9011 and thedata line region 9015. Depending on the specific requirements, theactive layer 917 may comprise a non-doped layer and a doped layer(neither is shown). Finally, a second patterned dielectric layer 927 isformed on the substrate 901. Depending on the requirements of themanufacturing process, the deposition rate of the second patterneddielectric layer 927 may be controlled in such a way that portions ofthe second patterned dielectric layer 927 formed earlier have asubstantially slower deposition rate than those formed later.

Next, as illustrated in FIG. 9C, a second patterned conductor structure919 is formed on the second patterned dielectric layer 927 in the TFTregion 9011 and a portion of the data line region 9015. A patternedprotective layer 921 is then formed on the substrate 901.

Finally, in reference to FIG. 9D, a patterned pixel electrode 923 isformed on the patterned protective layer 921 in the pixel region 9017.The patterned pixel electrode 923 is electrically connected to the firstpatterned conductor structure 9131 in the TFT region 9011 and isextended to the patterned protective layer 921 in a portion of the dataline region 9015. The method for forming a patterned pixel electrode 923may be determined depending on the requirements of the manufacturingprocess. For example, the method may be (1) common (i.e., a pixelelectrode 923 is first formed on the patterned protective layer 921,after which a patterned organic material layer (not shown) is formedthereon, and then portions of the pixel electrode 923 not covered by thepatterned organic material layer are removed), (2) the method forforming the structure of the first embodiment, (3) the method forforming the structure of the second embodiment, or (4) other suitablemethods. Here, a brief description is made with the method for formingthe structure of the second embodiment as an example. A patternedorganic material layer (not shown) is first formed on the substrate 901,which has a third opening (not shown) exposing a portion of thepatterned protective layer 921. Then, a pixel electrode 923 is formed onthe portion of the patterned protective layer exposed through the thirdopening and on the patterned organic material layer. Finally, thepatterned organic material layer and a portion of the pixel electrodethereon are removed to complete the structure shown in FIG. 9D.

The conductor structure, the pixel structure and the forming methodsthereof disclosed in this invention may be applied to an electro-opticaldevice as shown in FIG. 10. The electro-optical device 1001 comprises adisplay panel 1003, an electronic element 1007, and an electronicelement 1005 electrically connected to the display panel 1003. Thedisplay panel 1003 comprises a plurality of pixels 1007. The electronicdevice 1005 may be a control device, an operating device, a processingdevice, an input device, a memory device, a driving device, a lightemitting device, a protective device, a sensing device, a detectingdevice, or other functional devices, or a combination thereof. Theelectro-optical device 1001 may be a portable product (e.g., a handset,a video camera, a camera, a notebook type computer, a game console, awatch, a music player, an electronic photograph, an email transceiver, amap navigator, or a similar product), a video/audio product (e.g., avideo/audio player or a similar product), a display screen, a TV set, anindoor or outdoor visual panel, a panel in a projector, and etc.Additionally, the display panel 1003 may comprise an LCD panel (e.g., atransmissive type, a transflective type, a reflective type, adouble-sided type, a vertical alignment type (VA), an in-plane switchingtype (IPS), a multi-domain vertical alignment type (MVA), a twistednematic (TN) type, a super twisted nematic (STN) type, a patternvertical alignment (PVA) type, a super pattern vertical alignment(S-PVA) type, an advanced super view (ASV) type, a fringe fieldswitching (FFS) type, a continuous pinwheel alignment (CPA) type, anaxial symmetric microcell (ASM) type, an optical compensation bend (OCB)type, a super in-plane switching (S-IPS) type, an advanced superin-plane switching (AS-IPS) type, an ultra fringe field switching (UFFS)type, a polymer stable alignment (PSA) type, a dual-view type, atriple-view type, or other types, or a combination thereof), or anorganic electroluminescent display panel, depending on the displaymedium (e.g., a LC layer, an organic light-emitting layer (e.g.,monomers, polymers, or a combination thereof), or a combination thereof)electrically contacting at least one of the pixel electrodes and thedrain electrodes in the display panel.

Furthermore, at least one of the first patterned conductor structures,second patterned conductor structures and patterned pixel electrodesdescribed in the above embodiments may be formed optionally using themethod of the first embodiment or the second embodiment of thisinvention, depending on the requirements of the design (e.g., to reducethe number of masks, to reduce the cost, or other considerations). Forexample, if an additional patterned dielectric layer is needed in themethod for forming at least one of the first patterned conductorstructure, the second patterned conductor structure, and the patternedpixel electrode, the forming method for the first embodiment and itsvariations may be used. Alternatively, if no additional patterneddielectric layer is needed in the forming method of at least one of thefirst patterned conductor structure, the second patterned conductorstructure and the patterned pixel electrode, the forming method of thesecond embodiment may be used. Moreover, at least one of the firstpatterned conductor structure, the second patterned conductor structureand the patterned pixel electrode may be applied to various TFTscomprising a pixel structure.

In summary, by virtue of the lift-off process, this invention is able toform a conductor structure, and particularly, a pixel structure. Theability to effectively form metal conductors (particularly copperconductors) endows this invention with a high industrial applicability.The above disclosure is related to the detailed technical contents andinventive features thereof. People skilled in this field may proceedwith a variety of modifications and replacements based on thedisclosures and suggestions of the invention as described withoutdeparting from the characteristics thereof. For example, the patternedpixel electrodes in this invention may also be disposed under theconductor structure or used to replace the barrier layer. Further,lithographic procedures using masks of different transparency may alsobe employed in the method of this invention to reduce the number ofprocessing steps, wherein the lithographic procedures using masks ofdifferent transparency may be applied in individual layers of the pixelstructure, such as the active layer and the second patterned conductorstructure, the active layer and the insulating layer, the active layerand the etching stop layer or the like. Nevertheless, although suchmodifications and replacements are not fully disclosed in the abovedescriptions, they have substantially been covered in the followingclaims as appended.

1. A method for forming a conductor structure, comprising: providing asubstrate; forming a patterned dielectric layer on the substrate inwhich the dielectric layer has a first opening exposing a portion of thesubstrate; forming a patterned organic material layer on the patterneddielectric layer, in which the patterned organic material layer has asecond opening corresponding to a portion of the first opening and thesecond opening exposes the substrate through the first opening; forminga first barrier layer on a portion of the exposed portion of thesubstrate and on the patterned organic material layer; forming a metallayer on the first barrier layer; and removing the patterned organicmaterial layer, as well as the first barrier layer and the metal layerthereon.
 2. The method of claim 1, wherein the first opening has one endwith a first width being proximal to the substrate, and the other endwith a second width being distal from the substrate; and the secondopening has a third width substantially smaller than at least one of thefirst width and the second width.
 3. The method of claim 2, wherein thesecond width is substantially greater than the first one.
 4. The methodof claim 2, wherein the difference between the first width and thesecond width is substantially greater than or equal to 1 micrometer. 5.The method of claim 1, further comprising forming a second barrier layerwithin the first opening and on the metal layer, in which the metallayer is formed above the patterned organic material layer.
 6. Themethod of claim 1, wherein the upper portion and the lower portion ofthe patterned dielectric layer have different etching selectivities. 7.The method of claim 1, wherein the formation of the patterned dielectriclayer on the substrate, the deposition rate of the lower portion of thepatterned dielectric layer is substantially smaller than the depositionrate of the upper portion of the patterned dielectric layer.
 8. A methodfor forming a conductor structure, comprising: providing a substrate;forming a dielectric layer on the substrate; forming a patterned organicmaterial layer on the dielectric layer, in which the patterned organicmaterial layer has a first opening with a first width and the firstopening exposes a portion of the dielectric layer; removing a portion ofthe dielectric layer under the first opening to form a second openingcorresponding to the first opening for exposing a portion of thesubstrate, wherein the second opening has one end with a second widththat is proximal to the substrate, and the other end with a third widththat is distal to the substrate; forming a first barrier layer on thesubstrate within the second opening and on the patterned organicmaterial layer; and forming a metal layer on the first barrier layerwithin the second opening and on the patterned organic material layer;wherein the first width is substantially smaller than at least one ofthe second width and the third width, and the second width issubstantially smaller than the third width.
 9. The method of claim 8,wherein the step of removing a portion of the dielectric layer under thesecond opening comprises an over-etching process for forming the firstopening with a side wall of the dielectric layer, in which the side wallis formed within and under the patterned organic material layer.
 10. Amethod of forming a conductor structure, comprising: providing asubstrate; forming a patterned organic material layer on the substratein which the patterned organic material layer has a first opening thatexposes a portion of the substrate; forming a first barrier layer on aportion of the exposed portion of the substrate and on the patternedorganic material layer; forming a metal layer on the first barrierlayer; and removing the patterned organic material layer, as well as thefirst barrier layer and the metal layer on the patterned organicmaterial layer.
 11. The method of claim 10, wherein the first openinghas one end with a first width being proximal to the substrate, and theother end with a second width being distal from the substrate, in whichthe second width is substantially smaller than the first width.
 12. Themethod of claim 11, wherein the difference between the first width andthe second width is substantially greater than or equal to 1 micrometer.13. The method of claim 10, further comprising forming a second barrierlayer on the metal layer.
 14. A pixel structure, comprising: a substratewith a thin film transistor region, a scanning line region, a data lineregion, a pixel region, and a capacitance region; a patterned dielectriclayer formed on the substrate, in which the patterned dielectric layerhas a plurality of openings is adapted to individually expose a portionof the substrate in the thin film transistor region, the scanning lineregion, and the capacitance region; a first patterned conductorstructure formed above the exposed substrate within the openings in thethin film transistor region, the scanning line region, and thecapacitance region; an insulating layer formed above the substrate; anactive layer formed on the insulating layer in the thin film transistorregion; a second patterned conductor structure formed on the two ends ofthe active layer and on the insulating layer in the data line region;and a patterned protective layer formed above the substrate.
 15. Thepixel structure of claim 14, further comprising a patterned pixelelectrode formed on the patterned protective layer in the pixel regionand electrically connecting to one of the two ends of the active layer.16. The pixel structure of claim 14, wherein the active layer comprisesa non-doped layer and a doped layer, and two ends of the doped layerindividually connect the second patterned conductor structure.
 17. Thepixel structure of claim 14, further comprising an etching stop layerformed on the active layer.
 18. The pixel structure of claim 14, whereinat least one of the first patterned conductor structure and the secondpatterned conductor structure includes a barrier layer and a metallayer.
 19. The pixel structure of claim 14, wherein the second patternedconductor structure is formed on the insulating layer in the capacitanceregion.
 20. The pixel structure of claim 14, wherein the active layerand the second patterned conductor structure are formed on theinsulating layer in the capacitance region.
 21. The pixel structure ofclaim 14, wherein at least one of the first patterned conductorstructure and the second patterned conductor structure includes a firstbarrier layer, a metal layer, and a second barrier layer.
 22. The pixelstructure of claim 14, further comprising a further patterned dielectriclayer which is formed on a portion of the insulating layer and having aplurality of other openings for exposing the two ends of the activelayer.
 23. The pixel structure of claim 14, wherein the patterneddielectric layer is formed by a deposition process with variabledeposition rate and a deposition rate of an earlier formed portion ofthe patterned dielectric layer is substantially smaller than adeposition rate of a later formed portion of the patterned dielectriclayer.
 24. A display panel comprising the pixel structure of claim 14.